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Fowler Associates for ESD Consulting and Testing

Embedded Devices- New ESD Challenges

Steve Fowler, Fowler Associates
sfowler@sfowler.com
July 24, 2007

In the June 2008 Issue of Military and Aerospace Electronics, a radical change in electronics manufacturing was presented in the Article "Fairwell to Surface Mount" by Keith Gurnette and Tom Adams.

Click here for link to Military and Aerospace Electronics

Devices embedded in printed circuit boards has been studied for years.

Hiding Dies- HIgh Density Integration of Dies into Electronics Substrates

Verdant Electronics

It is becoming more possible and accepted. For those of us in the ESD industry. The challenges of such a technology is reminiscent of those we encounter in RFID manufacturing. Sensitive devices inside insulative PCBs are a new area where ESD safe manufacturing will be needed