ESD Control,
ROI (Return On Investment) ESD
CONTROL & (HUGE) COST SAVINGS Ryne
C. Allen November 1999
Reproduced with Permission, EE-Evaluation Engineering, November,
1999 INTRODUCTION
I Introduction
to ESD Control Programs
ESD Control programs are an essential part of a
quality process and are always needed when handling ESD sensitive electronic/semiconductor
devices. The extent of the ESD Control program is determined by the ESD Sensitive
(ESDS) devices themselves and how they are handled. Refer to article "How
to Set Up an ESD Control Program" [1] for additional information. One
of the main reasons that companies deploy ESD Control programs is to save money.
Increased throughput and decreased scrap can yield a Return On Investment (ROI
) of up to 1,000% per [2]. A secondary reason is to comply with their customers’
and ISO 9000 type programs’ requirements. Whatever reason, setting up and implementing
an ESD Control program will almost always produce favorable financial results.
II Cost
Reduction via ESD Control Programs
Having ESD awareness and following through with
an ESD Control program is essential in reducing quality failures due to ESD. ESD
can affect product reliability with catastrophic damage which is readily apparent
to latent degradation. Latent degradation is particularly expensive requiring
costly inspection and rework cycles in-house or product failure in the field.
Maintaining good ESD controls will improve product throughput or yield, increasing
reliability in the field which improves customer satisfaction leading to increased
future business. One test equipment
manufacturer noted that GMR heads were being damaged during or after
testing. These heads are extremely sensitive to ESD, and require additional handling
precautions. It is very important when
designing and implementing an ESD Control program to know the ESD susceptibility
of the ESD Sensitive (ESDS) devices you are trying to protect. Classification
of these devices should include all simulation models human body model (HBM),
Machine Mode (MM), and Charged-device Model (CDM) that will properly characterize
the devices' sensitivity when handled at various locations within the facility
[6]. This will allow for the most economical program design. Gene
Chase, an ESD Consultant with ETS Inc., is quoted as saying "Millions of
dollars are lost every year due to ESD [4]. Many of these incidents occur within
the computer and communications industry." Examples of losses from ESD may
be any of the following: - Lost
Time
- Loss of Connection
- Loss
of Data
- Shocks to Personnel
- Upset
to A System Requiring A Re-Boot
- Damage to Equipment
- Equipment
Hardware Failure
To properly
determine the return on investment (ROI) from your ESD Control program, you must
collect return, repair and scrap cost data before and after implementation. Terry
O’Malley, former AT&T ESD Manager, had collected data from several AT&T
facilities both before and after instituting an ESD Control program. The data
speaks for itself; see figure 1 for a graph of two facilities that were monitored.
There was over a 50% savings in return and repair costs found at both facilities
after initiating their ESD Control programs.
Figure 1 – Cost Reduction From ESD
Program, AT&T Office Location 
Figure 2 - ESD Design and Manufacturing Cost Analysis:
Combined Cost Benefits of ESD Program
Management [2] Figure 2 abstractly
represents the relative cost benefits of Lucent’s ESD Control program with the
relative compliance to this program [2]. A typical return on investment (ROI)
for a strict ESD Control program, like that used at Lucent Technologies, is typically
1,000 %. The design of the ESD Control program should be well thought out to minimize
unnecessary costs in the program, but with this knowledge, major quality and reliability
failures have been known to cost up to $10 million dollars each and jeopardize
sales. Protecting an ESDS device at all but one of the workstations is
not acceptable. For the ESD Control program to be effective, it must be comprehensive
and followed with discipline throughout the manufacturing, transport, and storage
cycle. Management commitment is an important element of any effective ESD Control
Program. ESD damage is not simple or inexpensive to identify. To improve quality
and profits, management should be involved. Over 21% of failure analysis is due
to electronics and industry studies showing that 30% of all electronic failures
can be attributed to ESD. Major companies including AT&T, Motorola,
Hewlett Packard and IBM have been able to successfully track ESD damage cost and
the resulting benefits of their ESD Control Programs. These companies have determined
that ESD Control is an essential part of their success, one that results in significant
investment pay-back, refer to Figure 1. Even with an ESD Control program
in place, a typical electronics company may lose 5% of revenue from all causes
of product failure. Cost avoidance is the biggest issue when it comes to implementing
an ESD Control program. Another source [5] states that a typical pay-back on an
ESD control program is 95:1. For every one-dollar invested in ESD control, ninety-five
dollars comes back as money saved [5].
V Increased Sensitivity to ESD Control and some
causes Difference
in component sensitivity between through-hole and surface mount devices is dependent
on the architecture and technology packaged. Typically, surface mount devices
have much smaller architecture making them more susceptible to ESD than through-hole
packaged devices. The width of the circuitry conductors is as small as 0.10 micrometer
(equal to 0.0001millimeter or 0.000004 inch). To pack more and more circuitry
into small packages, the spacing isolating circuitry has been reduced and can
be as little as 300 m m. A human being cannot
feel ESD voltage until it reaches approximately 3,000 volts. A discharge of static
electricity is literally a little lighting bolt, producing heat that can easily
burn through microelectronic architecture some rated with a withstand voltage
as low as volts.
|
Technology Trends |
| Year
| 1995
| 1998
| 2001
| 2004
| 2007
| | Feature
size (mm) |
0.35 |
0.25 |
0.18 |
0.12 |
0.10 | |
Voltage (V) |
3.5 |
2 - 3.5 |
1.50 – 1.9 |
1.0 – 1.5 |
1.0 |
Source: Terry Welsher, Bell Labs, Lucent Technologies,
12/2/97 [5] Table
I – Feature size and device power trends
For IC packaging, the Input/Output
(I/O) count has climbed from 600 to 1,000 to well over this now. This implies
that the spacing between the I/Os have decreased dramatically and where wire bonding
is used, the air gap becomes that much smaller making the neighboring I/Os even
more susceptible to ESD. This can be seen as Ball Grid Array (BGA) chips have
been replacing through-hole pin chip technology The increasing sophistication
of electronic devices has continued to make electronic devices more and more susceptible
to ESD related damage. This is a trend that is expected to continue.
Dry areas further add to the susceptibility of ESD Sensitive (ESDS) devices. Table
II shows normal activity within a production facility where triboelectric charging
levels of operators and objects are given in voltages and shown to be dependent
on relative humidity (RH). There can be over a 5 time increase in charge generation
when the RH drops to 10%.
|
Table II TYPICAL
ELECTROSTATIC VOLTAGES* | |
EVENT |
RELATIVE HUMIDITY |
| 10%
| 40%
| 55%
| | Walking
across carpet | 35,000
| 15,000
| 7,500
| | Walking
across vinyl floor |
12,000 |
5,000 |
3,000 | |
Motions of bench worker |
6,000 |
800 |
400 | |
Remove DIPs from plastic tubes |
2,000 |
700 |
400 | |
Remove DIPs from vinyl trays |
11,500 |
4,000 |
2,000 | |
Remove DIPs from Styrofoam |
14,500 |
5,000 |
3,500 | |
Remove bubble pack from PCBs |
26,000 |
20,000 |
7,000 | |
Pack PCBs in foam-lined box |
21,000 |
11,000 |
5,500 | |
*Source: AT&T ESD Control
Handbook-1989 |
There are a slew of other factors
that can add to the problems that need to be countered by a well designed ESD
Control program, such as: employee knowledge with training; ESD Control products
designed to protect the corresponding ESDS devices; program funding with management
buy-in; employee compliance with internal discipline and audits, etc.
Conclusion: A
properly designed and successfully deployed ESD Control program is a proven money
saver with an ROI of up to 1,000% per year. Another source reports that for every
one-dollar invested in ESD control, ninety-five dollars comes back as money saved.
Have you hugged your ESD Coordinator recently?
REFERENCES
-
"How
to Set UP and ESD Control Program", Allen, Ryne, EE, February 1999 -
ESD Program Management, 2nd Edition,
Dangelmayer, G. Theodore, Kluwer Academic Publishers, Boston, MA, 1999 -
Electrostatic Discharge Control, McAteer,
Owen J., McGraw Hill Publishing, New York, 1990 -
-
ESD Association, NE Chapter General Meeting,
Speaker: Terry Welsher, Bell Labs, Lucent Technologies, 12/2/97
-
About the Author Ryne
C. Allen is the technical manager at ESD Systems, a division of Desco Industries,
Inc. (DII). Previously, he was chief engineer and lab manager at the Plasma Science
and Microelectronics Research Laboratory at Northeastern University. Mr. Allen
is a NARTE-certified ESD control engineer and the author of 27 published papers
and articles. He is a member of the ESD Association and an active ADCOM member
of the local Northeast Chapter of the ESD Association. He graduated from Northeastern
University with B.S.E.E, M.S.E.E., and MBA degrees. ESD Systems, 19 Brigham St.,
Unit 9, Marlboro, MA 01752-3170, (508) 485-7390, resume: http://ryne.hotresume.net/,
e-mail: ryne@esdsystems.com,
URL: http://www.esdsystems.com. |