Full Version of
For The 21st Century
by Steve Fowler, Fowler Associates,
Now Downloadable - Click on the chapter to
dowload the Word 97 documents
This paper is vertually unchanged from the
version presented last century. It is being revised now that
it is in a downloadable form. Check back here next month for
the new and revised paper. It will include "clamshell"
packages and more on "air-gap shielding."
Abstract : Packaging of
electronic products for shipment has developed rapidly over
the past 30 years. Antistatic and other useful protective functions
of the packages have progressed to a high technological state.
This paper reviews that progress, describes present technologies
and forecasts future trends. Antistatic technologies for loadings
and coatings are covered both from a chemical as well as a practical
point of view. Antistatic, dissipative, electrostatic and rf
shielding properties are discussed. In this paper information
is presented on new shrink film technologies which are just
emerging. Automated packaging techniques as well as advances
in moisture barrier packaging are discussed . Using air
gaps as a method of electrostatic shielding has been around
for a long time. New advances in thermoform and inflatable packages
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